Teamgroup T-FORCE Vulcan Z Series 16GB (2 x 8GB) DDR4 3200MHz Memory TLZGD416G3200HC16CDC01

REINFORCED STRUCTURE
T-FORCE VULCAN Z is designed for complete protection and enhanced heat dissipation. The heat spreader is formed by the punch-press process with a 0.8mm thick, one-piece alloy aluminum to reinforce the body structure. In addition, coloring with an electrolytic anodizing process can enhance corrosion resistance and make it non-conductive.

ENHANCED HEAT DISSIPATION
With superconductivity and thermally conductive adhesive, these memory modules can quickly transfer the heat on IC chip through heat conduction to the aluminum alloy cooling module for better heat dissipation.

STABLE AND DURABLE
Every IC chip made for TEAMGROUP T-FORCE VULCAN Z DDR4 gaming memory is selected through a rigorous testing process. All overclocking memory is tested for complete compatibility and stability. This offers gamers a DDR4 memory with excellent quality, optimal performance, stability and compatibility.

SUPPORTS INTEL & AMD
It is compatible to both Intel & AMD platforms, therefore gamers can build their system without worries.

SUPPORTS XMP2.0
By using the XMP 2.0 technology, users are able to experience the thrill of overclocking easily.

Recommended reading:Teamgroup T-FORCE Vulcan Z Series 8GB (8GBX1) DDR4 3000MHz GRAY Memory TLZGD48G3000HC16C01

ENERGY SAVING
The basic working voltage is decreased to 1.2V. VULCAN Z saves on energy, has high performance and low power consumption.

Specification :

Model
Brand Team
Series T-FORCE VULCAN Z
Model TLZGD416G3200HC16CDC01
Details
Capacity 16GB (2 x 8GB)
Type 288-Pin DDR4 SDRAM
Speed DDR4 3200 (PC4 25600)
CAS Latency 16
Timing 16-18-18-38
Voltage 1.35V
ECC No
Buffered/Registered Unbuffered
Chipset Intel XMP 2.0
Color Gray
Heat Spreader Aluminum
Features Simple design to perfectly protect the cooling module
High thermal conductive adhesive
Supports Intel & AMD motherboards
Selected high-quality IC
Supports XMP2.0
Energy saving with ultra-low working voltage