TEAMGROUP T-FORCE DARK Za 32GB (2 x 16GB) DDR4 3600MHZ Memory TDZAD432G3600HC18JDC01
The heat spreader of T-FORCE DARK Z/Za series is formed by punch press process with a 0.8mm thick, one-piece alloy aluminum to reinforce the body structure. In addition, coloring with electrolytic anodizing process can enhance corrosion resistance and make it non-conductive.
REINFORCED STRUCTURE
The heat spreader of T-FORCE DARK Z/Za series is formed by punch press process with a 0.8mm thick, one-piece alloy aluminum to reinforce the body structure. In addition, coloring with electrolytic anodizing process can enhance corrosion resistance and make it non-conductive.
ENHANCED HEAT DISSIPATION
With superconductivity thermally conductive adhesive, it can quickly transfer the heat on IC chip through heat conduction to aluminum alloy cooling module for better heat dissipation. Therefore, the DARK Z/Za memory can offer the finest and smoothest gaming experience and an extreme performance without any lag.
SELECTED IC CHIPS STABLE AND DURABLE
Every IC chip made for TEAMGROUP T-FORCE DARK Z/Za DDR4 gaming memory is selected through a rigorous testing process. Every memory stick is tested for complete compatibility and stability. This offers gamers a DDR4 memory with excellent quality, optimal performance, stability and compatibility.
DARK Za DDR4 GAMING MEMORY
THE BEST SELECTION FOR AMD RYZEN 3000 SERIES
T-FORCE DARK Za DDR4 Gaming Memory is tailor-made for AMD Ryzen 3000 series processor and X570 motherboard. Tested under completed compatibility and stability, which can provide gamers a DDR4 gaming/overclocking memory with excellent quality and optimized performance.
Specification :
Model
Brand Team
Series T-FORCE DARK Za
Model TDZAD432G3600HC18JDC01
Details
Capacity 32GB (2 x 16GB)
Type 288-Pin DDR4 SDRAM
Speed DDR4 3600 (PC4 28800)
CAS Latency 18
Timing 18-22-22-42
Voltage 1.35V
ECC No
Buffered/Registered Unbuffered
Multi-channel Kit Dual Channel Kit
Color Black
Heat Spreader Aluminum
Features Armor design for perfect protection
Aluminum alloy heat sink with high performance
High thermal conductive adhesive
Tailor made for AMD
Selected high-quality IC
OC Profile Support
Energy saving with ultra-low working voltage
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